Atomic Scale Machining of Medical Materials

Abstract

Molecular dynamic simulations of machining at the atomic scale can reveal a significant amount of information regarding the behavior of machining and grinding processes that cannot be explained easily using classical theory or experimental procedures. This chapter explains how the use of molecular dynamic simulations can be applied to the many problems associated with machining and grinding at the meso, micro, and nanoscales. These include: (a) mechanics of nanoscale machining of ferrous and non-ferrous materials; (b) physics of nanoscale grinding of semiconductor materials; (c) effects of simulating a variety of machining parameters in order to minimize sub-surface damage; (d) modeling of exit failures experienced during machining such as burr formation and other dynamic instabilities during chip formation; (e) simulation of known defects in microstructures using molecular dynamic simulations, statistical mechanical, and Monte Carlo methods; (f) simulation of machining single crystals of known orientation; (g) extremely high speed nanometric cutting; (h) tool wear during machining; and (i) the effects of hardness on the wear of tool and workpiece materials. The nature of wear of the material ahead of the machining and grinding process, the variation of machining forces, and the amount of specific energy induced into the workpiece material using molecular dynamic simulations is discussed in this chapter.