Ekpu, Mathias, Bhatti, Raj, Okereke, Michael, Mallik, Sabuj ORCID: 0000-0002-2163-7620 and Otiaba, Kenny
(2014)
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.
Microelectronics Reliability, 54
(1).
pp. 239-244.
ISSN 0026-2714