Bernasko, Peter K and Mallik, Sabuj ORCID: 0000-0002-2163-7620
(2015)
Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint.
Soldering & Surface Mount Technology, 27
(1).
pp. 52-58.
ISSN 0954-0911
mathias, Ekpu, Bhatti, Raj, Okereke, Michael, Mallik, Sabuj ORCID: 0000-0002-2163-7620 and Otiaba, Kenny
(2014)
The effect of thermal constriction on heat management in a microelectronic application.
Microelectronics Journal, 45
(2).
pp. 159-166.
ISSN 0026-2692
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael, Mallik, Sabuj ORCID: 0000-0002-2163-7620 and Otiaba, Kenny
(2014)
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.
Microelectronics Reliability, 54
(1).
pp. 239-244.
ISSN 0026-2714