Bernasko, Peter K and Mallik, Sabuj ORCID: 0000-0002-2163-7620 (2015) Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology, 27 (1). pp. 52-58. ISSN 0954-0911
mathias, Ekpu, Bhatti, Raj, Okereke, Michael, Mallik, Sabuj ORCID: 0000-0002-2163-7620 and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). pp. 159-166. ISSN 0026-2692
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael, Mallik, Sabuj ORCID: 0000-0002-2163-7620 and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). pp. 239-244. ISSN 0026-2714